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? semiconductor components industries, llc, 2004 june, 2004 ? rev. 14 1 publication order number: mc34164/d mc34164, mc33164, ncv33164 micropower undervoltage sensing circuits the mc34164 series are undervoltage sensing circuits specifically designed for use as reset controllers in portable microprocessor based systems where extended battery life is required. these devices offer the designer an economical solution for low voltage detection with a single external resistor. the mc34164 series features a bandgap reference, a comparator with precise thresholds and built?in hysteresis to prevent erratic reset operation, an open collector reset output capable of sinking in excess of 6.0 ma, and guaranteed operation down to 1.0 v input with extremely low standby current. the mc devices are packaged in 3?pin to?226aa, micro size tsop?5, 8?pin soic?8 and micro8 ? surface mount packages. the ncv device is packaged in soic?8. applications include direct monitoring of the 3.0 v or 5.0 v mpu/logic power supply used in appliance, automotive, consumer, and industrial equipment. ? temperature compensated reference ? monitors 3.0 v (mc34164?3) or 5.0 v (mc34164?5) power supplies ? precise comparator thresholds guaranteed over temperature ? comparator hysteresis prevents erratic reset ? reset output capable of sinking in excess of 6.0 ma ? internal clamp diode for discharging delay capacitor ? guaranteed reset operation with 1.0 v input ? extremely low standby current: as low as 9.0 a ? economical to?226aa, tsop?5, soic?8 and micro8 surface mount packages ? ncv prefix for automotive and other applications requiring site and control changes ? pb?free packages are available figure 1. representative block diagram 1.2 v ref 2 (2) 1 (1) 3 (4) reset gnd input = sink only positive true logic pin numbers adjacent to terminals are for the 3?pin to?226aa package. pin numbers in parenthesis are for the 8?lead packages. this device contains 28 active transistors. see detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. ordering information soic?8 d suffix case 751 8 1 micro8 dm suffix case 846a 8 1 see general marking information in the device marking section on page 8 of this data sheet. device marking information (top view) 3 1 n.c. ground n.c. n.c. 2 4 8 7 6 5 n.c. n.c. input reset pin connections 1 2 3 to?226aa p suffix case 29 http://onsemi.com tsop?5 sn suffix case 483 1 5 pin 1. reset 2. input 3. ground 4. nc 5. nc tsop?5
mc34164, mc33164, ncv33164 http://onsemi.com 2 maximum ratings rating symbol value unit power input supply voltage v in ?1.0 to 12 v reset output voltage v o ?1.0 to 12 v reset output sink current i sink internally limited ma clamp diode forward current, pin 1 to 2 (note 1) if 100 ma power dissipation and thermal characteristics p suffix, plastic package maximum power dissipation @ t a = 25 c thermal resistance, junction?to?air d suffix, plastic package maximum power dissipation @ t a = 25 c thermal resistance, junction?to?air dm suffix, plastic package maximum power dissipation @ t a = 25 c thermal resistance, junction?to?air p d r ja p d r ja p d r ja 700 178 700 178 520 240 mw c/w mw c/w mw c/w operating junction temperature t j +150 c operating ambient temperature range mc34164 series mc33164 series, ncv33164 t a 0 to +70 ? 40 to +125 c storage temperature range t stg ? 65 to +150 c electrostatic discharge sensitivity (esd) human body model (hbm) machine model (mm) esd 4000 200 v maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected. mc34164?3, mc33164?3 series, ncv33164?3 electrical characteristics (for typical values t a = 25 c, for min/max values t a is the operating ambient temperature range that applies [notes 2 & 3], unless otherwise noted.) characteristic symbol min typ max unit comparator threshold voltage high state output (v in increasing) low state output (v in decreasing) hysteresis (i sink = 100 a) v ih v il v h 2.55 2.55 0.03 2.71 2.65 0.06 2.80 2.80 ? v reset output output sink saturation (v in = 2.4 v, i sink = 1.0 ma) (v in = 1.0 v, i sink = 0.25 ma) v ol ? ? 0.14 0.1 0.4 0.3 v output sink current (v in , reset = 2.4 v) i sink 6.0 12 30 ma output off?state leakage (v in , reset = 3.0 v) (v in , reset = 10 v) i r (leak) ? ? 0.02 0.02 0.5 1.0 a clamp diode forward voltage, pin 1 to 2 (i f = 5.0 ma) v f 0.6 0.9 1.2 v total device operating input voltage range v in 1.0 to 10 ? ? v quiescent input current v in = 3.0 v v in = 6.0 v i in ? ? 9.0 24 15 40 a 1. maximum package power dissipation limits must be observed. 2. low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 3. t low = 0 c for mc34164 t high = +70 c for mc34164 =?40 c for mc33164, ncv33164 = +125 c for mc33164, ncv33164
mc34164, mc33164, ncv33164 http://onsemi.com 3 mc34164?5, mc33164?5 series, ncv33164?5 electrical characteristics (for typical values t a = 25 c, for min/max values t a is the operating ambient temperature range that applies [notes 5 & 6], unless otherwise noted.) characteristic symbol min typ max unit comparator threshold voltage high state output (v in increasing) low state output (v in decreasing) hysteresis (i sink = 100 a) v ih v il v h 4.15 4.15 0.02 4.33 4.27 0.09 4.45 4.45 ? v reset output output sink saturation (v in = 4.0 v, i sink = 1.0 ma) (v in = 1.0 v, i sink = 0.25 ma) v ol ? ? 0.14 0.1 0.4 0.3 v output sink current (v in , reset = 4.0 v) i sink 7.0 20 50 ma output off?state leakage (v in , reset = 5.0 v) (v in , reset = 10 v) i r (leak) ? ? 0.02 0.02 0.5 2.0 a clamp diode forward voltage, pin 1 to 2 (i f = 5.0 ma) v f 0.6 0.9 1.2 v total device operating input voltage range v in 1.0 to 10 ? ? v quiescent input current v in = 5.0 v v in = 10 v i in ? ? 12 32 20 50 a 4. maximum package power dissipation limits must be observed. 5. low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 6. t low = 0 c for mc34164 t high = +70 c for mc34164 =?40 c for mc33164, ncv33164 = +125 c for mc33164, ncv33164 7. ncv prefix is for automotive and other applications requiring site and change control. 0 v in , input voltage (v) r l = 82 k to v in t a = 25 c 2.0 4.0 6.0 8.0 10 v o , output voltage (v) figure 2. mc3x164?3 reset output voltage versus input voltage 0 v in , input voltage (v) figure 3. mc3x164?5 reset output voltage versus input voltage r l = 82 k to v in t a = 25 c 2.0 4.0 6.0 8.0 10 v o , output voltage (v) 10 8.0 6.0 4.0 2.0 0 10 8.0 6.0 4.0 2.0 0
mc34164, mc33164, ncv33164 http://onsemi.com 4 i in , input current ( a) m v in , threshold voltage (v) v o , output voltage (v) figure 4. mc3x164?3 reset output voltage versus input voltage -50 t a , ambient temperature ( c) -25 0 25 50 75 100 125 v in , threshold voltage (v) upper threshold high state output lower threshold low state output figure 5. mc3x164?5 reset output voltage versus input voltage 4.22 v in , input voltage (v) 4.26 4.30 4.34 4.38 figure 6. mc3x164?3 comparator threshold voltage versus temperature figure 7. mc3x164?5 comparator threshold voltage versus temperature figure 8. mc3x164?3 input current versus input voltage v o , o utput v o lta g e ( v ) figure 9. mc3x164?5 input current versus input voltage 2.62 v in , input voltage (v) r l = 82 k to v in t a = 25 c 2.66 2.70 2.74 2.78 -50 t a , ambient temperature ( c) -25 0 25 50 75 100 125 upper threshold high state output lower threshold low state output v in , input voltage (v) 2.0 4.0 6.0 8.0 10 t a = 0 c t a = 70 c i in , input current ( a) m 0 v in , input voltage (v) 2.0 4.0 6.0 8.0 10 r l = 82 k to v in t a = 25 c 4.36 4.32 4.28 4.24 4.20 5.0 4.0 3.0 2.0 1.0 0 5.0 4.0 3.0 2.0 1.0 0 2.76 2.72 2.68 2.64 2.60 50 40 30 20 10 0 0 50 40 30 20 10 0 t a = 25 c t a = 0 c t a = 70 c t a = 25 c
mc34164, mc33164, ncv33164 http://onsemi.com 5 t a = 0 c v ol , output saturation (v) 0 i sink , sink current (ma) 4.0 8.0 12 16 20 t a = 70 c t a = 0 c v in , reset = 4 v figure 10. mc3x164?3 reset output saturation versus sink current figure 11. mc3x164?5 reset output saturation versus sink current figure 12. clamp diode forward current versus voltage v ol , output saturation (v) figure 13. reset delay time (mc3x164?5 shown) 0 v sink , sink current (ma) 4.0 8.0 12 16 , forward voltage (v) 0.4 0.8 1.2 1.6 i f , forward current (ma) 20 t a = 25 c figure 14. low voltage microprocessor reset power supply 1.2 v ref microprocessor circuit 2 (2) r 1 (1) 3 (4) reset c dly a time delayed reset can be accomplished with the addition of c dly . for systems with extremely fast power supply rise times (<500 ns) it is recommended that the rcdly time constant be greater than 5.0 s. v th(mpu) is the microprocessor reset input threshold. t dly = r cdly in 1 ? v th(mpu) 1 v in t a = 25 c t a = 0 c t a = 70 c t a = 25 c v in = 0 v t a = 25 c v f v in = 2.4 v t a = 70 c t a = 0 c t a = 25 c reset v in v in = 5.0 v to 4.0 v r l = 43 k t a = 25 c reset v in 5.0v 4.0v ref 43k 90% 5.0 v 4.0 v 5.0 s/div 10 % 4.0 3.0 2.0 1.0 0 4.0 3.0 2.0 1.0 0 32 24 16 8.0 0 0 t a = 70 c
mc34164, mc33164, ncv33164 http://onsemi.com 6 figure 15. low voltage microprocessor reset with additional hysteresis (mc3x164?5 shown) power supply 1.2 v ref microprocessor circuit 2 (2) r l 1 (1) 3 (4) reset comparator hysteresis can be increased with the addition of resistor r h . the hysteresis equation has been simplified and does not account for the change of input current i in as v in crosses the comparator threshold (figure 8). an increase of the lower threshold v th(lower) will be observed due to i in which is typically 10 a at 4.3 v. the equations are accurate to 10% with r h less than 1.0 k and r l between 4.3 k and 43 k . v h 4.3 r h r h mc3x164-5 i in v in test data v h (mv) v th (mv) r h ( ) r l (k ) 60 103 123 160 155 199 280 262 306 357 421 530 0 1.0 1.0 1.0 2.2 2.2 2.2 4.7 4.7 4.7 4.7 4.7 0 100 100 100 220 220 220 470 470 470 470 470 43 10 6.8 4.3 10 6.8 4.3 10 8.2 6.8 5.6 4.3 r l + 0.06 v th(lower) 10 r h x 10 -6 where: r h 1.0 k 43 k r l 4.3 k figure 16. voltage monitor figure 17. solar powered battery charger figure 18. mosfet low voltage gate drive protection using the mc3x164?5 1.2 v ref 2 (2) 270 1 (1) 3 (4) power supply 1.2 v ref 2 (2) 1.0 k 1 (1) 3 (4) 1.2 v ref 2 (2) 1 (1) 3 (4) solar cells r l mtp3055el mc3x164-5 v cc 4.3v overheating of the logic level power mosfet due to insuf ficient gate voltage can be prevented with the above circuit. when the input signal is below the 4.3 v threshold of the mc3x164-5, its output grounds the gate of the l 2 mosfet.
mc34164, mc33164, ncv33164 http://onsemi.com 7 ordering information device package shipping 2 mc33164d?3 soic?8 98 units / rail mc33164d?3r2 soic?8 2500 units / tape & reel ncv33164d?3r2* soic?8 2500 units / tape & reel mc33164dm?3r2 micro8 4000 units / tape & reel mc33164p?3 to?92 2000 units / box mc33164p?3ra to?92 2000 units / tape & reel mc33164p?3rp to?92 2000 units / pack mc33164d?5 soic?8 98 units / rail mc33164d?5r2 soic?8 2500 units / tape & reel mc33164d?5r2g soic?8 (pb?free) 2500 units / tape & reel ncv33164d?5r2* soic?8 2500 units / tape & reel mc33164dm?5r2 micro8 4000 units / tape & reel mc33164dm?5r2g micro8 (pb?free) 4000 units / tape & reel mc33164p?5 to?92 2000 units / box mc33164p?5ra to?92 2000 units / tape & reel mc33164p?5rp to?92 2000 units / pack mc34164d?3 soic?8 98 units / rail mc34164d?3r2 soic?8 2500 units / tape & reel mc34164dm?3r2 micro8 4000 units / tape & reel mc34164p?3 to?92 2000 units / box mc34164p?3rp to?92 2000 units / pack mc34164d?5 soic?8 98 units / rail mc34164d?5r2 soic?8 2500 units / tape & reel mc34164dm?5r2 micro8 4000 units / tape & reel mc34164sn?5t1 tsop?5 3000 units / tape & reel mc34164p?5 to?92 2000 units / box mc34164p?5ra to?92 2000 units / tape & reel mc34164p?5rp to?92 2000 units / pack *ncv33164: t low = ?40 c, t high = +125 c. guaranteed by design. ncv prefix is for automotive and other applications requiring site and change control. 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc34164, mc33164, ncv33164 http://onsemi.com 8 alywy 3x164 1 8 soic?8 d suffix case 751 src = device code x = device number 3 or 4 y = suffix number 3 or 5 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week pin connections and marking diagrams micro8 mc33164dm case 846a miy0 yww awl 1 8 to?92 mc3x164p?y case 29 mc3x1 64py yww micro8 mc34164dm case 846a mcy0 yww awl 1 8 to?92 mc3x164p?yra mc3x164p?yrp case 29 mc3x1 64p?y yww 123 123 tsop?5 sn suffix case 483 srcyw 123 54
mc34164, mc33164, ncv33164 http://onsemi.com 9 package dimensions to?226aa p suffix case 29?11 issue al notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j l b k g h section x?x c v d n n xx seating plane 1 dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.021 0.407 0.533 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 --- 12.70 --- l 0.250 --- 6.35 --- n 0.080 0.105 2.04 2.66 p --- 0.100 --- 2.54 r 0.115 --- 2.93 --- v 0.135 --- 3.43 ---
mc34164, mc33164, ncv33164 http://onsemi.com 10 package dimensions tsop?5 sn suffix plastic package case 483?01 issue c 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 soldering footprint notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. a and b dimensions do not include mold flash, protrusions, or gate burrs. dim min max min max inches millimeters a 2.90 3.10 0.1142 0.1220 b 1.30 1.70 0.0512 0.0669 c 0.90 1.10 0.0354 0.0433 d 0.25 0.50 0.0098 0.0197 g 0.85 1.05 0.0335 0.0413 h 0.013 0.100 0.0005 0.0040 j 0.10 0.26 0.0040 0.0102 k 0.20 0.60 0.0079 0.0236 l 1.25 1.55 0.0493 0.0610 m 0 10 0 10 s 2.50 3.00 0.0985 0.1181 0.05 (0.002) 123 54 s a g l b d h c k m j __ _ _
mc34164, mc33164, ncv33164 http://onsemi.com 11 package dimensions soic?8 d suffix case 751?07 issue ab 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751?01 thru 751?06 are obsolete. new standard is 751?07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ?x? ?y? g m y m 0.25 (0.010) ?z? y m 0.25 (0.010) z s x s m
mc34164, mc33164, ncv33164 http://onsemi.com 12 package dimensions micro8 dm suffix case 846a?02 issue f s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c --- 1.10 --- 0.043 d 0.25 0.40 0.010 0.016 g 0.65 bsc 0.026 bsc h 0.05 0.15 0.002 0.006 j 0.13 0.23 0.005 0.009 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. 846a-01 obsolete, new standard 846a-02. ?b? ?a? d k g pin 1 id 8 pl 0.038 (0.0015) ?t? seating plane c h j l 8x 8x 6x mm inches scale 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mc34164/d micro8 is a trademark of international rectifier. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.

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